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Computer-On-Module, or COM, is a development board with computer processor, chipset, cooler, heat sink,, memory, ecc memory, secure boot, and peripherals designed into a component module. jdb kredit Computer-on-module series macth PIMCG and include: COM-HPC, COM-Express Basic, COM-Express Compact, COM-Express Mini, QSeven(Q7), Smarc, and ETX.

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    A new module standard with next level CPUs, more memories, and next generation high-speed I/Os like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE

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      COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE
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      COM-HPC Client has A/B/C three sizes with 3 DDI, 1 eDP, 2 Soundwire, and next gen. high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE
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    COM Express Basic is euipped with the latest processor. It can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI and IDE for legacy applications. COM Express Basic Module is equipped with high-end processor in a board size of 125mm x 95mm.

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      COM Express Basic Type 7 provides super speed I/Os and high bandwidth expansion interfaces such as USB3.0, SATAIII and PCIe gen3. It’s also integrated 10GbE interface for huge data transmission.
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      COM Express Basic Type 6 provides triple DDI display interfaces, HDA, abundant super speed I/Os and high bandwidth expansion interfaces such as USB3.1, SATAIII and PEG/PCIe gen3. It comes with excellent computing and graphics performance.
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      COM Express Basic Type 2 is a legacy specification, support PCI, IDE, LVDS and VGA for legacy applications; also has high speed I/Os interface includes PCIe and SATA.
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    COM-Express Compact is compact module that includes Intel Core i ULT 9th Generation, Intel Atom processor, which the best solution for mobile applications.

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      COM Express Compact Module is equipped with low-power processor in a board size of 95mm x 95mm. Type 6 provides DDI display interface, HDA, super speed I/Os and high bandwidth expansion interfaces such as USB3.0, SATAIII and PCIe gen3. It offers a balance performance with low power consumption.
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      COM Express Compact Module is equipped with low-power processor in a board size of 95mm x 95mm. Type 6 provides DDI display interface, HDA, super speed I/Os and high bandwidth expansion interfaces such as USB3.0, SATAIII and PCIe gen3. It offers a balance performance with low power consumption.
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    COM Express Mini Module is equipped with Entry processor in a board size of 84mm x 55mm and Intel Atom. It supports memory down and onboard storage for ruggedized applications.

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    SMARC is a small form factor that connects to carrier board by golden finger. It supports low power and wide range computing performance in two module size (82x50mm/82x80mm); also comes with onboard memory & storage. jdb kredit SMARC is integrated dual LAN and wireless technology.

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    In ultra-small form factor and Intel Atom, Qseven can deal with low power processors with on-board memory and storage. Qseven module transfers all the major signals and interface to the carrier board via golden fingers at the PCB edge.

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    ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. jdb kredit is a founding member of the ETX Industrial Group (ETX-IG).

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    jdb kredit Development boards provide a schematic software & reference design to reduce efforts needed in development stage. jdb kredit Development Board can be used to test carrier board problems and support COM series, RTX, SMARC, Qseven, and ETX / XTX form factors.

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    jdb kredit Application Board is application-oriented development board which provides a schematic reference to reduce design effort at the development stage.

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    jdb kredit X86 evaluation kits provide a complete set of COM, development board and peripheral, customers can do quick start for their system design.

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